Packaging Architect

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Advanced Packaging Innovation: Specify advanced packaging solutions for next-generation applications, including solution generation, automation, iterative analysis, and figure of merit definition.
• Technology Integration: Apply new technology rules, limitations, and their impact on package integration, such as co-packaged copper, co-packaged optics, advanced interposers (organic and silicon bridge-based), and on-package memory integration with HBM, LPDDR, DDR.
• Innovation Exploration: Drive 1-3 technology innovation exploration activities by working closely with development teams and third-party providers to understand capabilities and map them to the product roadmap.
• Cross-Functional Collaboration: Collaborate with silicon, system, and customer teams to define package architectures that balance performance, power, cost, and manufacturability.
• Tool Development: Develop automation and analysis tools for package specifications to enhance design efficiency and accuracy.
• Mentorship: Mentor early career employees, fostering a culture of continuous learning and innovation.

What We're Looking For

• Educational Background: Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related fields with 10+ years of related professional experience, or a Master's degree and/or PhD with 5+ years of experience.
• Technical Expertise: Proven experience in package architecture tradeoff analysis (3D, 2.5D, MCM, design partitioning), cost/benefit analysis, PPA tradeoffs, and risk analysis for new technologies.
• Analytical Skills: Strong problem-solving and troubleshooting skills with demonstrated attention to detail.
• Communication: Excellent verbal and written communication skills, with the ability to interact smoothly with challenging customers and demands.
• Leadership: Ability to be a strong individual contributor as well as a team player, working successfully with cross-functional teams.
• Adaptability: Highly motivated and able to react quickly and with urgency to changes

Preferred Qualifications

• Advanced Packaging Technologies: Experience with advanced packaging technologies, including 2.5D/3D packaging, SiP, Flip Chip, and WLP.
• Memory Integration: Experience in HBM on-package integration, DDR integration, and working knowledge of various memory types.
• EDA Tools: Familiarity with various EDA & CAD tools used in package design and analysis.
• Industry Collaboration: Experience working with major OSATs (ASE, AMKOR, SPIL, etc.) and an extensive personal network within key OSATs.

Please note, this role is a daily on-site role in our Burlington, VT location. We are not seeking remote or hybrid employees.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.