RF Hardware Engineering Lead - Space RF Systems

We are seeking a RF Hardware Lead to drive the design, integration, and delivery of high-reliability RF/mixed-signal printed circuit assemblies for phased-array and advanced radar/communications products. You will own the PCB lifecycle-from stack-up definition and layout governance through fabrication, assembly, bring-up, and release-while leading functional team to meet performance, cost, schedule, and quality objectives for DoD programs and working closely in a cross-functional team.

On any given day, the selected candidate may be asked to perform the following:

• Define multilayer, hybrid dielectric RF stack- including impedance tables, via strategy (blind/buried, backdrill, VIPPO), copper weights, and plating/finish (ENIG/ENEPIG) to meet RF loss, isolation, and manufacturability targets.
• Partition boards for RF, mixed-signal, and high-speed digital with attention to shielding, grounding, return paths, and thermal management (coins, thermal vias, heat spreaders).
• Establish and enforce RF layout rules (transitions, launch geometries, via fences, cavity cutouts, keep-outs) and high-speed constraints (length/phase matching, crosstalk control, reference continuity).
• Lead/perform SI/PI/RF simulation and verification (e.g., ADS, HFSS, SIwave/Sigrity, CST) to predict insertion loss, VSWR/return loss, coupling, eye margins, and PDN impedance.
• Lead schematic capture, ECAD library governance (footprints/3D models), and DRC/DFM sign-off in Altium/Cadence/Mentor.
• Run formal design reviews, drive closure of action items, and maintain design histories, BOMs, and ECOs through PLM.
• Own fab and assembly drawing packages, stack-up notes, controlled impedance requirements, coupons, panelization, and testability features.
• Collaborate with PCB fabs/CMs on builds (Class 3), negotiate tolerances, and resolve issues (mask alignment, plating thickness, impedance yield, lamination strategy).
• Plan and execute board bring-up; define acceptance tests and interface with RF test for S-parameters, noise figure, PAE, ACPR/EVM, and linearity (P1dB/IP3/AM-AM/AM-PM).
• Drive root-cause and corrective action (RCCA) for yield/field issues; partner with Reliability/ESS for environmental compliance
• Provide technical leadership and mentorship to PCB layout engineers and RF/digital designers; develop design guides, checklists, and training.
• Coordinate with cross functional team and lead RF hardware system design
• Ensure documentation meets DoD/contractual requirements, configuration control, and ITAR/export compliance; maintain clean, version-controlled release artifacts.

Required Qualifications

• Bachelor's degree in electrical engineering or related engineering field.
• Experience: 5+ years in RF/microwave and mixed-signal PCB development for high-reliability products; demonstrated ownership from concept through production.
• Technical Depth:
  
  
  
  • Proven expertise in RF board layout for L/S/C/X/Ku/Ka-band front-ends (LNAs, PAs, switches, beamformers, PLL/synth, couplers/splitters).
  • Hands-on with hybrid stack-ups, controlled impedance design, backdrill/HDI strategies, and thermal/shielding practices.
  
  
  
  
• Tools: Proficiency with one or more ECAD suites (Altium Designer, Cadence Allegro/OrCAD, Mentor/Xpedition) and analysis tools (Keysight ADS, Ansys HFSS/SIwave, CST).
• Standards/Quality: Working knowledge of IPC-2221/2223, IPC-6012, IPC-A-600/-610 Class 3, ANSI/ESD S20.20, and DoD documentation practices.
• Ability to obtain a DoD Top-Secret/SCI clearance.

Desired Qualifications

• Master's degree preferred.
• Experience delivering phased-array TR modules, beamforming IC integrations, or wideband front-ends in production.
• Background in design for ruggedization and environmental screening (thermal cycling, vibe/shock) and reliability analysis (derating, FMEA).
• Familiarity with PLM (e.g., Arena/Windchill), manufacturing with domestic CMs, and rapid RCCA/MRB/CCB processes.
• Exposure to mmWave packaging, RF connectors/launches (SMPM/SMP/SEARAY/coax launches), and fixture design for S-parameter/over-the-air test.
• Certifications (IPC CID/CID+), or equivalent PCB design credentials.
• Excellent technical communication, supplier interaction, and concise documentation skills.
• Track record leading cross-functional design efforts, running reviews, and mentoring engineers.
• Active Secret or TS preferred.

Salary Range: $115,000 - $150,000
The BlueHalo pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Determination of official compensation or salary relies on several factors including, but not limited to, level of position, job responsibilities, geographic location, scope of relevant work experience, educational background, certifications, contract-specific affordability, organizational requirements, alignment with local internal equity as well as alignment with market data.

Our compensation package also includes components designed to support employees' total well-being, which should be considered when evaluating our competitive benefits package. These benefits include health insurance, life insurance, disability, company holiday and paid time off, parental leave, 401(k) company match and contributions, professional development/training reimbursements, and other work/life programs.