New

Technical Director

Skyworks Solutions, Inc
$170,100.00 - $339,500.00 / yr
parental leave, paid time off, 401(k)
United States, California, Irvine
5260 California Avenue (Show on map)
Feb 26, 2026
Job Description Apply now Job Title: Technical Director Posting Start Date: 2/26/26 Job Location(s): Irvine If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID: 77055 Job Description: Description Technical Director - Package Technology Development Highly visible role that will lead the development of advanced heterogeneous RF packaging technologies that integrate RF, analog, and digital functions into compact, high-performance modules. You will define package architectures and baseline assembly processes optimized for RF performance, thermal management, reliability, yield, and cost across Skyworks' mobile, automotive, IoT, and infrastructure product portfolios and the ability to lead cross-functional teams while managing relationships with substrate suppliers, OSATs, foundries and internal factory partners Responsibilities Principal Duties & Responsibilities Lead development of advanced RF packaging technologies from architecture definition through high-volume manufacturing, integrating multiple die technologies (GaAs, GaN, SOI, SiGe, CMOS) into system-in-package solutions Develop and optimize RF-specific packaging capabilities and performance. Hands on application of multiple assembly technologies: flip-chip, fan-out, wafer-level packaging, die stacking, and hybrid bonding as appropriate for RF applications. Develop compelling packaging roadmap that delivers next generation that is ahead of the competition. Lead cross-functional development teams spanning RF design, signal integrity, thermal engineering, product engineering, reliability, quality, and operations. Required Experience and Skills Qualifications MS or PhD electrical, Mechanical, Materials Engineering, or Physics, with +5yrs of leadership experience in leading advanced packaging technology development, new product introduction, and high-volume manufacturing. RF packaging expertise is a plus. Proven experience with multiple packaging platforms: LGA, system-in-package (SiP), cavity packages, air-cavity designs, overmolded modules, and fan-out packaging applied to RF applications Zero defect mindset from new technology development to high volume release Strong background in statistical tools, DFMEA/PFMEA, DFM Demonstrated track record - managing complex new technology programs with aggressive schedules, cost optimized and on-time delivery to the customer. Excellent communication skills, ability to translate vision to tangible actions, executive level communication, strong influence to internal and external stakeholders. Understanding of automotive (AEC-Q100/Q200), HiRel and telecommunications reliability standards, and various failure analysis techniques. Experience and dominate advance interconnections as TSV, micro bumps, hybrid bonding . Knowledge in new product introduction and process transfer from design to mass production Understanding APQP and PPAP standards. Up to 25% domestic and international travel to supplier and development facilities. Desired Experience and Skills The typical base pay range for this role across the U.S. is currently USD $170,100 - $339,500 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com. Apply now